SPECTRA COOLTM is an ultra high efficiency heat transfer compound designed for and recommended to remove the air gap between microprocessors and heat sinks. It is the ultimate compound to ensure maximum heat removal. 

Features:  A non-silicone, non-contaminating synthetic ester base in a smooth homogeneous paste which makes application a snap.  Superior heat transfer with no separation or bleed which cause other brands to loose their efficiency.  With highly improved heat transfer it's like your CPU is getting a blast of cold arctic air.
 

SPECTRA COOL tm thermal compound is 3-5 times more effective than adhesive films often supplied with heat sinks.  Adhesive films should be removed and discarded before applying thermal compound and should never be used with them.  Your processor and heat sink should be cleaned of any old compound before applying SPECTRA COOL tm.  While SPECTRA COOL tm does not conduct electricity in the PC environment care should be taken not to contaminate the CPU pins or mother board with heat sink grease during cleanup or application.

Purchase this product from a SPECTRA COOL Distributor today