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Application of SPECTRA COOL thermal compound KEEP OUT OF THE REACH OF CHILDREN! Stick, Cap, Syringe and plastic bag are an eye, choking, suffocation and ingestion hazard.
SPECTRA COOL APPLICATION INSTRUCTIONS
INSPECT AND CLEAN
Before applying SPECTRA COOL thermal compound inspect the fan for proper operation and clean all contamination from the blades and housing with a small brush or q-tip. Make sure the blades spin freely and do not wobble. Clean the heat sink fins with a small paintbrush or compressed air. Some brushing may be required to remove all contamination. Next clean and inspect the heat sink surface. We strongly recommend using Acetone or lighter fluid for cleaning all old thermal interface material from the heat sink and CPU using q-tips or a soft bristle toothbrush. Never use thermal compound with thermal pads. Insure that cotton fibers or bristles do not remain on the heat sink or CPU after cleaning. Do not soak the CPU with cleaner, use just enough to remove the old material. Do not touch the cleaned surfaces with your fingers. Oil from your fingers can interfere with proper function of the compound. Use a straightedge to determine if the heat sink surface is flat. Lay the straightedge across the cleaned surface in several different directions with a light source behind the heat sink and you should see an even ray of light if it is flat. Uneven light especially more light in the middle means the surface needs to be lapped for optimum results. Too deep of a concave surface can result in overheating and/or CPU FAILURE due to insufficient contact with the CPU. If a piece of notepaper can freely be slipped under the straightedge in the center of the heat sink do not proceed with installation without first lapping the surface. Below is an exaggerated illustration of a concave heat sink. If the heat sink needs lapping to correct a poor surface condition use our Lapping Kit # L5 to recondition the heat sink. It is a simple process that can enhance the performance of just about any heat sink.
Use of a CPU shim is not recommended. Inspect the CPU pads on all small core CPUs making sure they are in good condition. They prevent the heat sink from putting too much pressure on the core, which can cause cracking resulting in CPU FAILURE.
APPLICATION OF THERMAL COMPOUND After cleaning and inspection as described above has been done use the applicator to spread a small quantity of thermal compound onto the processor. Small core processors generally require about 2 small rice grains of compound. See the illustration below for the small core CPU. With a larger CPU contact area use accordingly. For Pentium 4 processors start with about 5-6 rice grains of compound spreading thin and evenly. If more is needed it can be added. Use enough compound to cover the CPU core or lid evenly as a very thin film about the thickness of a piece of note paper. Attach the heat sink to the processor. Move the heat sink gently and slightly against the processor to eliminate the air gap. The heat generated by the processor will help disperse the compound evenly. Do not over apply--too much is worse than not enough. Avoid contact with the CPU pins & circuit boards.
For the small core processor apply and spread evenly about 2 rice grains of compound to start, add more only if needed.
KEEP OUT OF THE REACH OF CHILDREN! Stick, Cap, Syringe and plastic bag are an eye, choking, suffocation and ingestion hazard.
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